| 摘要 |
<p>PROBLEM TO BE SOLVED: To prepare a multilayered printed wiring board excellent in through- hole reliability by a dry system manufacturing method. SOLUTION: A both-side metal foil clad laminated plate is obtained by forming a projection of a truncated cone for a through-hole in one surface of a metallic plate, forming a resin insulating layer somewhat thinner than the projection on the projected side, placing a metal foil thereon, and laminating it under heating and pressure. A both-sided metal foil clad multilayered plate is obtained by using the both-sided metal foil clad laminated plate, subjecting the laminated plate to a circuit formation and surface chemical treatment, and laminating it with a metal plate having a one-side projection of a truncated cone in place of a through-hole as an outer layer. The obtained both-side metal foil clad multilayered plate is used as the multilayered printed wiring board. Since the projection of a truncated cone shape made in one side of the metal plate is used as the through-hole, there can be manufactured a multilayered printed wiring board excellent in through-hole reliability.</p> |
