| 摘要 |
PROBLEM TO BE SOLVED: To enable a carrier to be transferred also vertically in a semiconductor manufacturing device with only a first load port. SOLUTION: A load port device A has an upper surface, that is a carrier temporary placement surface 1, and is composed of a load port device body B, that is installed immediately in front of a first load port P1 , where only a front surface is opened and a carrier transfer mechanism E that is provided at the load port device body B and transfers a carrier, that is placed temporarily on the carrier tentative placement surface 1 on the upper surface into the first load port P1 . In this case, the load port device A is installed at the front side of the first load port P1 . |
