HIGH DENSITY MULTI-CHIP MODULE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To attain laminated high density by using a generally used semiconductor chip as it is at the time of constituting a multi-chip module. SOLUTION: This high density multi-chip module is provided with semiconductor chips 1 and 2 integrated by joining the mutual non-circuit faces, and a sub-substrate 5 electrically/mechanically connected with an MCM substrate 3. One semiconductor chip 1 of the integrated semiconductor chips 1 and 2 is flip-chip connected with the MCM substrate 3, and the other semiconductor chip 2 is connected by bonding with the sub-substrate 5.