发明名称 FERROELECTRIC MEMORY DEVICE AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To enhance reliability in a data overwrite life span, by a method wherein an upper electrode formed on a ferroelectric film contains a lamination containing a conductive oxide layer of a metal connected to the ferroelectric film. SOLUTION: A ferroelectric capacity element contains a lower electrode 3, an upper electrode 5 and a ferroelectric film intervened therebetween. A contact hole through the upper electrode 5 is provided in a protection film, and the ferroelectric capacity element through the contact hole is electrically connected to a memory transistor via a wiring layer 10. A wiring layer 6 as a bit line and the wiring layer 10 connected to the upper electrode 5 has a structure of laminating a metal silicide layer such as tungsten silicide (WSix ) or the like, or a material composed mainly of aluminum or titanium nitride on the metal silicide layer. It is possible to restrict a deterioration of the ferroelectric capacity element by heating, after the wiring layer is formed due to the WSix as the metal silicide of the wiring layer 10.
申请公布号 JPH11297942(A) 申请公布日期 1999.10.29
申请号 JP19980095846 申请日期 1998.04.08
申请人 NEC CORP 发明人 SHINOHARA SOTA;AMANUMA KAZUSHI;MURAO YUKINOBU;KATO ARIMITSU;TAKEUCHI TSUNEO;HAYASHI YOSHIHIRO
分类号 H01L21/8247;H01L21/02;H01L21/822;H01L21/8242;H01L21/8246;H01L27/04;H01L27/10;H01L27/105;H01L27/108;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/8247
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