| 摘要 |
<p>Portable communication equipment provided with an antenna and a power amplifier circuit module for amplifying high-frequency signals emitted from the antenna, wherein the power amplifier circuit module is provided with a wiring board (1) and a semiconductor element (CHT) (2) which is mounted on the wiring board (1) and electrically and mechanically connected to the board (1) through a plurality of bump electrodes (3), characterized in that the substrate (1) has conductors (4 and 5) which are electrically and mechanically connected to part of the bump electrodes (3) and work as heat dissipating paths. The portable communication equipment is further characterized in that the wiring board (1) is constituted in a multilayered wiring board composed of multiple wiring layers and the conductors (4 and 5) used as the above heat dissipating paths are formed through each wiring layer of the multilayered wiring board, thereby further reducing the size of the power amplifier circuit module and, accordingly, the portable communication equipment.</p> |
