| 摘要 |
The lead frame 11 comprises a planar semiconductor element die pad 12 for supporting a semiconductor element and slits 13 extending through the semiconductor element die pad 12. Each slit 13 is formed so that its side wall surfaces on the longitudinal edges of the slit are inclined in the opposite sense to the side wall surfaces of the end walls of the slit. The inclination of the side walls of the slits prevents cracking of the resin encapsulation due to moisture absorption and subsequent heat treatment. |
