| 摘要 |
A stand-off pad (102), and method of fabricating the same, for supporting a workpiece (106) in a spaced apart relation to a workpiece support chuck (112). More specifically, the wafer stand-off pad (102) is fabricated of a polymeric material, such as polyimide, which is disposed upon the support surface of the chuck (114). The stand-off pad maintains a wafer, or other workpiece (106), in a spaced apart relation to the support surface of the chuck (114). The distance between the underside surface of the wafer (106) and the chuck (100) is defined by the thickness of the stand-off pad. This distance should be larger than the expected diameter of contaminant particles (110) that may lie on the surface of the chuck. In this manner, the contaminant particles do not adhere to the underside of the wafer during processing and the magnitude of the chucking voltage is maintained between the workpiece and the chuck. <IMAGE> |
