发明名称 |
PROCESS FOR SELECTIVE APPLICATION OF SOLDER |
摘要 |
Process for the selective formation of contact metallisations on terminal areas of a substrate, wherein the surface of the substrate is covered with a template in such a way that template openings forming deposit spaces are arranged above the terminal areas, and wherein the deposit spaces are filled with a solder material, and fusing of the solder material is effected with a view to forming the contact metallisations in the deposit spaces which are non-wettable at least in regions of contact with the solder material. |
申请公布号 |
EP0951734(A1) |
申请公布日期 |
1999.10.27 |
申请号 |
EP19970937439 |
申请日期 |
1997.08.08 |
申请人 |
PAC TECH - PACKAGING TECHNOLOGIES GMBH |
发明人 |
SCHREDL, JUERGEN;KASULKE, PAUL |
分类号 |
H01L21/60;H01L21/48;H05K3/12;H05K3/34;(IPC1-7):H01L21/48 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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