SEMICONDUCTOR NON-LAMINATE PACKAGE AND METHOD

摘要

A semiconductor device package (50) includes a carrier substrate molded (52) of a non-laminate material. A plurality of conductive material metal balls (54) are molded within the non-laminate carrier substrate to provide an electrical connection between opposite sides of the substrate (52). The conductive metal balls (54) provide conductive columns (88) through the substrate (52) for electrically connecting a chip (60) mounted on one side of the substrate (52) to solder balls (62) on an opposite side of the substrate for mounting the package (50) on a printed circuit board. The conductive columns (88) eliminate the need for via holes which are used in known packages. The package (50) with conductive columns (88) provides a more compact, more precise, and lower cost package which is less susceptible to moisture damage than the known packages employing via holes.