| 摘要 |
A 4-methyl-1-pentene resin composition comprising (A) 20 to 60 parts by weight of poly-4-methyl-1-pentene or a copolymer chiefly composed of 4-methyl-1-pentene, (B) 30 to 60 parts by weight of an ethylene/butene copolymer, (C) 5 to 40 parts by weight of poly-1-butene or a copolymer chiefly composed of 1-butene and another alpha -olefin, and (D) 0 to 30 parts by weight of a propylene/butene copolymer is provided. The composition of the present invention has excellent heat resistance, transparency, gas permeability, mold releasability, liquid drainability, heat seal strength, and impact resistance. Especially, it has excellent adhesive properties to 4-methyl-1-pentene resin and other resins and is preferably used for the production of laminated products.
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