| 摘要 |
PROBLEM TO BE SOLVED: To maintain flatness and parallelism with high accuracy even when polishing a workpiece having a large diameter by arranging the support part supporting the outer peripheral edge part by setting the workpiece horizontal and rotatably supporting the peripheral edge part with the central shaft as the rotational center. SOLUTION: The wafer support part 50 has four guides 51a to 51d rotatably sandwiching the outer peripheral edge part Wc of a wafer W and autorotating with a shaft C as the rotational center and a workpiece rotating motor 52 for revolvingly driving the guide 51a. The wafer W is sandwiched by the guides 51a to 51d. Next, elastic body plates 32, 42 are positioned in a state of a degree of not applying pressure to the wafer W. By reciprocating a polishing cloth rotating motor 62 by a lower polishing plate reciprocating motor 63, a polishing cloth 66 is reciprocated, and at the same time, a polishing cloth 76 is reciprocated to polish the workpiece. |
