| 摘要 |
PROBLEM TO BE SOLVED: To provide a board plating method, which is capable of uniformly forming a plating film on ultra-fine wiring grooves present on the surface of a plating board and the inner wall of an ultra-fine contact hole through an electroless plating method. SOLUTION: A plating film is formed by electroless plating on the surface of a board 2 or an ultra-fine wiring groove of width 0.18μm or less provided to the surface of the board 2 and the inner wall of an ultra-fine contact hole of diameter 0.18μm or less through a board plating method, wherein an electroless plating solution is atomized into mist which is 0.1μm or less in grain diameter, and the mist of plating solution is sprayed on the surface of a board 2 for plating. In this way, an electroless plating solution is atomized into mist of diameter 0.1μm or less, whereby the mist of plating solution can be easily made to penetrate into an ultrafine wiring groove or an ultrafine contact hole through a charge induction method or the like, so that a plating film which is uniform in thickness can be formed on the inner walls of a wiring groove or in a contact hole.
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