| 摘要 |
PROBLEM TO BE SOLVED: To enhance the uniformity in polishing the whole work surface by making uniform the pressure distribution over the whole work surface including the peripheral zone. SOLUTION: This carrier 1 is composed of a housing 10, carrier base 11, sheet supporter 13, hard sheet 18, soft backing sheet 19, and a collar 20, wherein the sheet supporter 13 is formed from a supporter body 14 having an aeration hole 14a in communication with an air inlet/outlet 11b provided in the carrier base 11, a flexible diaphragm 15, and edge ring 16. Thereby the force applied to the edge ring 16 of the sheet supporter 13 is relieved by deflection of the disphragm 15 so as to make uniform the air pressure in a pressure chamber R to be applied to the whole surface of a wafer W. |
