| 摘要 |
PROBLEM TO BE SOLVED: To allow an interface between first and second interlayer insulating layers and the surface of second interlayer insulating layer to be flat. SOLUTION: At forming an insulating layer 3 and an adhesive layer 7 succeedingly on a lower-layer pattern 2, the insulating layer 3 is formed to cover the lower-layer pattern 2, which is pressed to flatten a surface 4 of the insulating layer 3, and then the adhesive layer is formed. Thus, a surface 8 of the adhesive layer 7 as well as the interface 4 between the insulating layer 3 and the adhesive layer 7 become flat surfaces. So, the film thickness of the insulating layer 3 above the lowerlayer pattern 2 is constant, resulting in good insulation performance between the lower-layer pattern and an upper-layer pattern formed thereafter. In addition, the film thickness of the adhesive layer 7 is constant, and adhesion between the upper-layer pattern and a component, in mounted condition as well as seated condition, are good. |
