| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an IC suction collet which is capable of chucking an IC chip without causing damages to it and possessed of a suction surface that is improved in durability. SOLUTION: An IC suction collet 1 is equipped with a collect main body 2 of conductive rubber, wherein the collet main body 2 is formed like a cylindrical body with a tapered head. A center hole 2b is bored in the one edge face 2a of the collect main body 2, and a mounting part of an IC mounter is inserted into the center hole 2b and fixed. A center hole 2c smaller than the center hole 2b is provided to the other edge face 2d of the collet main body 2. A cylindrical suction part 3 of conductive resin has a flange 3d, and the axial part 3c of the chucking part 3 is fitted and fixed in the hole 2c provided to the collet main body 2, bringing the flange 3d into close contact with the edge face 2b of the collet main body 2. A center hole 3a is provided which penetrates through the suction part 3 and communicates with an air hole provided to the mounting part of the IC mounter. The edge face 3b of the chucking part 3 is made to serve as the chucking face which chucks an IC chip.</p> |
