| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic temperature adjusting device capable of improving temperature adjusting capability by reducing thermal resistance of substrates clamping thermoelectric semiconductor. SOLUTION: A cooling side substrate 130 and a heat radiating side substrate 132 which constitute an electronic cooling device 104 for an optical module 100 are composed of silicon. On the facing surfaces of the substrates 130 and 132, silicon oxide films 130a and 132a and electrodes 134 are formed in order. In an electronic cooling element 136, P-type thermoelectric semiconductor 136a and an N-type thermoelectric semiconductor 136b are clamped, via electrodes 134, by the cooling side substrate 130 and the heat radiating side substrate 132, and connected in series by using the electrodes 134. An optical modulator 110 is fixed on the cooling side substrate 130, via a base 106 and a chip carrier 108. When a current is made to flow from the N-type thermoelectric semiconductor 136b to the P-type thermoelectric semiconductor 136a, the optical modulator 110 is cooled. |
