发明名称 Heat exchange passage connection
摘要 The present invention provides a method and apparatus for improving thermal management of gas being delivered to a chemical vapor deposition chamber. Thermal management is accomplished using a heat transfer fluid in thermal communication with the deposition gas passageways delivering the gases to the chamber for deposition. The gas injection manifold includes gas passageways and coolant liquid passageways, wherein the gas passageways extend through a constant voltage gradient gas feedthrough and the coolant liquid passageways extend through a gas input manifold coupled to the inlet end of the constant voltage gradient gas feedthrough. This arrangement provides for increase coolant liquid flow and allows maintenance or disassembly of the constant voltage gradient gas feedthrough without breaking the seal on the coolant liquid system.
申请公布号 US5968276(A) 申请公布日期 1999.10.19
申请号 US19970893859 申请日期 1997.07.11
申请人 APPLIED MATERIALS, INC. 发明人 LEI, LAWRENCE;TRINH, SON;JOHNSON, MARK
分类号 H01L21/205;C23C16/44;C23C16/455;H01L21/285;(IPC1-7):C23C16/00 主分类号 H01L21/205
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