| 摘要 |
PURPOSE: To raise density of a bond pad while keeping a minimum distance of a wire in a center part of a side face of a chip. CONSTITUTION: A plurality of relative offsets exist for a contiguous bond pad 3. A space between the contiguous bond pads 3 changes. To have a plurality of relative offset amounts means that, on a side face of an integrated circuit chip 1, at least two pairs of the continuous bond pads 3 in which the relative offset amount differs can be selected, and the selection of the relative offset amount minimizes a space between the bond pads and satisfies conditions of packages. When the contiguous bond pads 3 have the relative offset amount, a separation amount in a side face direction between centers of the bond pads 3 becomes generally smaller than in the case of no relative offset amount. The relative offset amount in an any changes, and in the array of the bond pads 3, it is possible to attain smaller chips than those manufactured in the case where the relative offset amount is constant. |
