| 摘要 |
<p>PROBLEM TO BE SOLVED: To restrain a semiconductor device from being tilted, even if a solder bump is made to melt when mounting the semiconductor device on a head board. SOLUTION: A large number of output terminals 2 are arranged in rows on the main surface of a rectangular silicon board in the length wise direction, and solder bumps are each formed on the output terminals 2 for the formation of a semiconductor device. The output terminals 2 are arranged in plural rows A and B, and the outermost rows A and B are arranged on each side of a center line H, which separates the silicon board 1 in two halves in a crosswise direction.</p> |
