| 摘要 |
<p>PROBLEM TO BE SOLVED: To make a wiring for short-circuit possible to be exposed without increasing the number of processes even at the time of electrically connecting a picture element electrode and a drain area through a drain electrode and to level out the ruggedness. SOLUTION: In this production method for active matrix substrate, a cutting hole 4b which exposes a predetermined part to be cut of a wiring 3b for short- circuit is formed in a first inter-layer insulating film 4 simultaneously with formation of first and second contact holes 4a and 4d. After an insulating film 71 obtained by baking of a coating film of a composition including polysilazane is used to form a second inter-layer insulating film 7, a cutting hole 8b is formed in this second inter-layer insulating film 7 simultaneously with formation of a third contact hole 8a, and the predetermined part to be cut of the wiring 3b for short-circuit is exposed.</p> |
