| 摘要 |
PROBLEM TO BE SOLVED: To improve the light pickup efficiency from a light emitting device, by laying a light scattering layer on the bottom of a recess around an LED chip, and providing a light-permeable sealing material for protecting the LED chip in the recess. SOLUTION: A light scattering layer 101 is to pick up a light emitted with a lateral vector from an LED chip 103, without guiding in a light-permeable sealing material 102 and hence may be any one which is disposed around the LED chip 103 and capable of efficiently scattering/diffusion reflecting a light from the LED chip 103. A resin contg. a light-scattering/diffusing inorg. member has pref. a high permeability to the light from the LED chip and high adhesion to the diffusing material, light-permeable seal 102 and package 107 and high heat resistance. The light scattering layer 107 can be comparatively simply formed by pouring and hardening the resin in a recess of the package 107 where the LED chip 103 is previously disposed. |
