发明名称 MATERIAL FOR FILM FORMATION AND INTERCONNECTION FORMING METHOD
摘要 A layer forming material is a compound which has a structure of six-membered ring coordinated to Cu and containing Si, and of which general formula is represented by the following chemical formula: <CHEM> wherein X1 and X2 are elements of the VI group of the same or different types which are coordinate-bonded to Cu, and of which examples include O, S, Se, Te and the like, at least one of Y1, Y2 and Y3 is Si, L is a group which has a double or triple bond and which is able to supply electrons to Cu, and each of R1 and R2 is any of SiF3, SiH3, CF3 and CH3 for example. <IMAGE>
申请公布号 KR100225686(B1) 申请公布日期 1999.10.15
申请号 KR19960002480 申请日期 1996.02.01
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO.. LTD. 发明人 KAWAGUCHI, AKEMI;KOUSAKU, YANO;TERAI, YUKA
分类号 C23C16/18;H01L21/3205;H01L21/768;H01L23/532;(IPC1-7):H01L21/205 主分类号 C23C16/18
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