| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip size package type semiconductor device using a heat spreader which has a stress relaxing ability, heat resistance, electrolytic corrosion resistance and moisture resistance and is previously coated with and adhesive which reduces the deterioration caused by the moisture-resistance test under severe conditions such as pressure cooker test treatment. SOLUTION: Using a heat spreader 5 previously coated with an adhesive 3 a semiconductor chip 2 is adhered to the heat spreader 5, the adhesive 3 contains an epoxy resin having a wt. average mol.wt. of less than 5000 and its hardening agent 100 parts wt. in total, together with a hardening accelerator 0.1-5 parts wt. and epoxy group-contg. acrylic copolymer contg. a copolymer unit origination from glycidile (meta)acrylate 2-6 wt.% and having a glass transition temp. of -10 deg.C or higher and wt. average mol.wt. of 600000 or more, 100-300 parts wt. |
