APPARATUS FOR REMOVING VOID DURING SOLDERING PROCESS OF INTEGRATED CIRCUIT,申请号KR19960042029U-传众专利搜索

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发明名称	APPARATUS FOR REMOVING VOID DURING SOLDERING PROCESS OF INTEGRATED CIRCUIT
摘要
申请公布号	KR200158883(Y1)	申请公布日期	1999.10.15
申请号	KR19960042029U	申请日期	1996.11.26
申请人	DAEWOO ELECTRONIC COMPONENTS CO.,LTD	发明人	UM, KI-JUN
分类号	H01L23/48	主分类号	H01L23/48
代理机构		代理人
主权项
地址

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