| 摘要 |
PURPOSE:To obtain an epoxy resin composition for semiconductor sealing having excellent soldering heat-resistance and thermal conductivity by compounding an epoxy resin having a specific structure with a curing agent and silicon nitride and/or silicon carbide. CONSTITUTION:The objective composition is produced by compounding (A) 4-20wt.% of an epoxy resin containing >=50wt.% of an epoxy resin of formula (R<1> to R<6> are H, halogen or 1-4C alkyl) (e.g. 1,5-diglycidylnaphthalene), (B) 2-15wt.% of a curing agent (e.g. phenolic novolak resin), (C) 1-95wt.% of silicon nitride and/or silicon carbide and (D) 0.1-20wt.% of a styrene-based block copolymer. |
