发明名称 |
Microetching composition for copper or copper alloy |
摘要 |
A microetching composition for copper or copper alloys comprising, (a) an oxidizing agent which can oxidize the copper or copper alloy, (b) a polymer compound which contains polyamine chains or a cationic group or both in the amount of 0.000001 to 1.0% by weight, and (c) water. The composition can produce surfaces of copper or copper alloy exhibiting excellent adhesion to resins such as prepregs and resists, and superior solderability. The composition can be adaptable to the manufacture of printed wiring boards with highly integrated fine line patterns.
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申请公布号 |
US5965036(A) |
申请公布日期 |
1999.10.12 |
申请号 |
US19970789206 |
申请日期 |
1997.01.24 |
申请人 |
MEC CO., LTD. |
发明人 |
MAKI, YOSHIRO;NAKAGAWA, TOSHIKO;YAMADA, YASUSHI;HARUTA, TAKASHI;ARIMURA, MAKI |
分类号 |
C23F1/18;H01L21/308;H05K3/06;H05K3/28;H05K3/38;H05K3/46;(IPC1-7):C09K13/00 |
主分类号 |
C23F1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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