EPOXY RESIN COMPOSITION FOR SEALING OF SEMICONDUCTOR, AND SEMICONDUCTOR APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing of a semiconductor which can be fire-retardant by use of a red phosphorus without decrease of reliability of moisture resistance of the semiconductor and does not necessitate mixing of an ion scavenger. SOLUTION: The epoxy resin composition for sealing of a semiconductor mainly comprises an epoxy resin, a hardening agent, an hardening accelerator and an inorganic filler. A fire retardant comprising a fine particle of a red phosphorus having a average diameter of 1-6μm and a thermosetting resin layer and an inorganic layer covering the surface thereof is mixed in the composition. It is possible to make the composition to be fire-retardant by use of the red phosphorus without use of a halogen-based fire retardant or an antimony trioxide and to maintain stability of the red phosphorus by the thermosetting resin layer or the inorganic layer which prevents the red phosphorus from absorbing moisture. It is further possible, by use of the fine particle of the red phosphorus having an average diameter of 1-6μm, to obtain a red phosphorus-based fire retardant having a small diameter with keeping thickness of thermosetting resin layer or the inorganic layer which can be easily dispersed in the epoxy resin composition for sealing semiconductor and to maintain reliability of moisture resistance without use of an ion scavenger.