发明名称 TRANSFERRING MATERIAL AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a method of covering a conductive layer on a transferring work. SOLUTION: It comprises steps of forming a first electric-insulative mask pattern 2 on the surface of a conductive substrate 1, forming a second electric- insulative mask pattern 8 on the first mask pattern 2, forming a base conductive layer 9 higher than the height of the first mask pattern 2 on an unmasked part 3 of the substrate 1 by the electrodeposition, forming a conductive layer 4 on the base conductive layer 9 by the electrodeposition, removing the second mask pattern 8 on the substrate 2 after forming the conductive layer, forming a barrier conductive layer 7 on the conductive layer 1 after moving the second mask pattern, and forming an adhesive layer 15 on the barrier conductive layer 7.
申请公布号 JPH11274695(A) 申请公布日期 1999.10.08
申请号 JP19980068994 申请日期 1998.03.18
申请人 DAINIPPON PRINTING CO LTD 发明人 MIKAMI MITSUO
分类号 H05K3/20;H05K3/46;(IPC1-7):H05K3/20 主分类号 H05K3/20
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