| 摘要 |
PROBLEM TO BE SOLVED: To reduce a maximum supply electric power amount at an electric power supply part, which supplies an electric power to a substrate thermal processing device. SOLUTION: A heating process part 1 for heating a substrate W and a cooling process part 2 for cooling the substrate W are provided, and the heating process part 1 and the cooling process part 2 are supplied with an electric power for temperature control. The heating process part 1 and the cooling process part 2 used for alternately heating process and cooling process, are supplied with the electric power for temperature control from a common electric poser supply part 3, and a substrate transfer device 5 transfers the heating process part 1 and the cooling process part 2 to the substrate W, so that the substrate W is thermally processed by only either the heating process part 1 or the cooling process part 2 to which the electric power is supplied from the electric power supply part 3. |
