| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for mounting a multilayer electronic component which can realize a high density mounting and reduce the number of manufacturing processes. SOLUTION: This substrate has a laminate 7 made by laminating a plurality of insulating substrates 71-73 having conductor patterns 211, 202, 203, 214, 205, 216 through prepregs 6, a recessed section 3 for mounting an electronic component condution holes 10, 11a, 11b,... for electrically connecting the conductor patterns in different layers, and connection terminals such as solder balls 8 for interaction of electricity with outside. The bottoms of the conduction holes 10, 11a, 11b,... are coated with coating pads 25 and the insides are applied with conductive material such as metal plating films 26. It is preferred that the recessed section 3 for mounting is formed on the side formed with connection terminals for the substrate for mounting a multilayer electronic component and part of the conductor patterns is located on its inner wall. |
