发明名称 CUTTING APPARATUS FOR ADHESIVE TAPE
摘要 <p>PROBLEM TO BE SOLVED: To provide a cutting apparatus capable of preventing defective flaking state in an adhesive tape during the cutting of the adhesive tape. SOLUTION: A tape cutting apparatus 30 includes at least two or more cutters 33 joined to a rotating body 31, and a role 34 joined to a rear side of each cutter 33. When the rotating body 31 is rotated, the cutter 33 is moved rotatively along the ring frame to cut the adhesive tape 20. The role 34 pushes the inner part of adhesive tape so that the adhesive tape 20 on the inner side after cutting is not flaked. In addition, the tape cutting apparatus 30 may include a sensitive sensor 37 for detecting the rotation of the rotating body 31.</p>
申请公布号 JPH11274111(A) 申请公布日期 1999.10.08
申请号 JP19980366424 申请日期 1998.12.24
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 RI SEIKO;RI YOTETSU;KO SEIFUKU;SO KEIFUKU
分类号 B26D1/16;B26F1/38;H01L21/00;H01L21/02;H01L21/301;(IPC1-7):H01L21/301 主分类号 B26D1/16
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