| 摘要 |
PROBLEM TO BE SOLVED: To allow recognizing orientation of a device, related to a ball grid array(BGA) type semiconductor device, when viewed from the rear surface side of a wiring board. SOLUTION: A semiconductor chip is provided on a front surface side of front and rear surfaces of a wiring board 1, while a plurality of external connection terminals are provided on a rear surface side to constitute a package structure. On the rear surface of the wiring board, each of four regions obtained by quartering with the center line in its X-direction and that in Y-direction has a mark 13, with a mark provided in one region different from others. the mark provided in one region comprises a through-hole formed across front and rear surfaces of the wiring board 1, and the mark provided on the other region constitutes a through-hole formed across the front and rear surfaces of the wiring board 1 and a stopper which is so formed on the front surface of the wiring board 1 as to plug the through-hole. |
