| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a large inductance in a second-dimensional shape, suited for being formed corresponding to high integration or high density mounting on each kind of circuit board even by a technique, which can be easily applied to the manufacture of a multi-layer circuit board. SOLUTION: An inside conductor line 32 and an outside conductor line 33 for inductance formation are formed through an interval in the shape of a closed curve satisfying at least one of prescribed conditions (1)-(3) on a dielectric substrate 31, and one part is cut, and one end of the inside conductor 32 is connected with the other end of the outside conductor line 33, and terminal conductors 34a and 34b for outside lead- through are connected with the other edge of the inside conductor line 32 and one end of the outside conductor line 33 and an inductor can be constituted. This is a closed curve arranged in a square frame to be linearly symmetrical with respect to the two diagonals of the frame (1), closed curve arranged in a square large frame in which four closed curves are connected in a prescribed procedure so as to be linearly symmetrical to the two diagonals of the large frame (2), and closed curved arranged by reducing or enlarging at least one part in the frame or the large frame, and deforming the closed curve in (1) or the closed curve (2) on a plane or a curved surface.</p> |
