| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a compact package, whose mounting area is reduced, and to avoid the faults by the adsorption of solder in mounting. SOLUTION: An island part 13 and a lead part 14 are formed on the surface of an insulating substrate 11 and electrically connected to outer electrodes 15 and 16 by way of through holes 17 and 18. A semiconductor chip 12 is mounted on the island part 13 and wire-bonded to the lead part 14. The upper part of the semiconductor chip 12 is covered with a resin 21, and dicing is performed. Thus, an outer end surface 11a of the insulating plate 11 and an outer end surface 21a of the resin 21 are made to be the continuous same horizontal surface. The gold plated layer of the island part 12 and the lead part 13 are made to retreat from the vicinity of the outer end surface 11a.</p> |
