| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processor capable of extracting a wafer from a cassette or conveying the wafer to a wafer processing part without lifting any cassette. SOLUTION: This device is provided with a pedestal 11 for stopping and placing a cassette C. By lifting an indexer carrier unit 30 movable along with the pedestal 11, a wafer W is extracted from the cassette C. The wafer W is moved to a wafer delivering position P while being placed on the supporting pin of the unit 30. After the wafer is aligned by a wafer matching mechanism loaded on the unit 30, the supporting pin is moved up and the wafer W is carried up to the height for delivering it to a process carrier unit. The process carrier unit receives the wafer W on the supporting pin and carries it to respective processing units 231 , 232 and 241 -243 . Since the cassette C is not lifted in the extraction or conveyance process of the wafer W, dusting caused by the vibrations of the cassette C can be prevented. |
