| 摘要 |
PROBLEM TO BE SOLVED: To protect a chip against cracking so as to improve a semiconductor device in reliability. SOLUTION: A semiconductor device is composed of inner leads 2b extending on the circuit-formed surface 1a of a semiconductor chip 1 where a memory integrated circuit is formed, a package main body 3 formed by sealing the inner leads and the semiconductor chip 1, outer leads 2c connected to the inner leads 2b protruding from the package main body 3, insulating tapes 4 bonded to the inner edges of the inner leads 2b and mounted with the semiconductor chip 1, and wires 5 which electrically connect the bonding pad 1e of the semiconductor chip 1 to the inner leads 2b, wherein an opening 1c provided for the fuse region 1d of a redundant circuit of a protective film 1b formed on the circuit-formed surface 1a of the semiconductor chip 1 is covered with the insulating tape 4. |
