WAFER STICKING PLATE AND METHOD FOR POLISHING SEMICONDUCTOR WAFER WHILE USING THE PLATE

摘要

PROBLEM TO BE SOLVED: To provide a wafer sticking plate, with which the generation of fine crack on the rear surface of a semiconductor wafer can be prevented and the strength of the semiconductor wafer can be prevented from being lowered after polishing, and a method for polishing semiconductor wafer while using the same. SOLUTION: Concerning a wafer sticking plate 1, the surface coarseness of a face to stick semiconductor wafer 2 is Ra more than 0.0001 μ-m and less than 0.1 μm. Concerning the method for polishing semiconductor wafer, the semiconductor wafer 2 is stuck on the sticking face of the wafer sticking plate 1 having the surface coarseness Ra more than 0.0001 μm and less than 0.1 μm and the surface of the semiconductor wafer 2 is polished.