| 摘要 |
A process for the minute processing of diamonds which comprises preparing a substrate; forming a first buffer layer on the substrate; forming a second buffer layer, having a higher charge transfer rate than both the substrate and the first buffer layer, on the first layer; selectively removing the first and second buffer layers to selectively expose the surface of the substrate; depositing diamonds on the whole surface of the exposed surface of the substrate and the remaining first and second buffer layer; and removing the by-products formed on the surface of the second buffer layer and surface thereof. |
