| 摘要 |
PROBLEM TO BE SOLVED: To provide a method by which a high-density build-up multilayered wiring board in which fine conductor patterns can be formed easily and which has high parts mountability and connection reliability can be manufactured efficiently. SOLUTION: A build-up multilayer printed wiring board is manufactured in such a way that a conductor pattern 31 is formed by selectively etching the first copper layer 301 of composite metal foil composed of the copper layer 301, a nickel-phosphorus alloy layer 302, and a second copper layer 303 and a thermosetting insulating resin layer containing a filler is formed on the surface of the pattern 31. Then a strippable organic film 4 is formed on the surface of the insulating resin layer and a non-through hole 7 reaching the surface of the pattern 31 is formed through the insulating resin layer and film 4 at a location proposed for electrical connection with a laser beam. After the formation of the hole 7, the hole 7 is filled up with conductive paste 71 and the organic film 4 is stripped off. Then a laminated body is obtained by putting the insulating resin layer on an innerlayer circuit and pressurizing and heating the layer and board and only the second copper layer 303 and nickel-phosphorus alloy layer 302 are removed from the laminated body. |
