| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic multilayered wiring board which can prevent the occurrence of defective connection between an inner wiring layer and a via hole caused by the worse printability, etc., of the end section of an unbaked inner wiring layer. SOLUTION: The end sections 8a of an inner wiring layer 8 which connects the end faces 7a of the via holes 7 of upper and lower ceramic layers 2 to each other are protruded from the via hole 7 by about 20μm. Consequently, the reliability of the electrical connection between the inner wiring layer 8 and the via hole 7 can be improved, because the layer 8 can be connected to the via hole 7 before the via hole 7 is baked by not using the end sections 8a of the wiring layer 8 having worse printability against conductor paste, but the sections of the layer 8 on the inside of the end sections 8a at the time of manufacturing an unbaked wiring board. |
