| 摘要 |
PROBLEM TO BE SOLVED: To provide a developing method and apparatus which can make uniform the line width of a circuit pattern formed on a substrate by controlling developing operation on the substrate. SOLUTION: A developing solution is applied onto a wafer W, a head member 106 is disposed as opposed to the wafer W, and then fluid is discharged from fluid outlet ports 110 of the head member 106 toward the developing solution on the wafer W during developing operation of the wafer W to supply the fluid to an area of the circuit pattern where the line width become nonuniform. Thereby the temperature, thickness, liquid surface condition, etc., of the developing solution of the area can be controlled. |
