| 摘要 |
PROBLEM TO BE SOLVED: To attain high density mounting by making this device compact and thin, to reduce cost, to simplify treatment, and to stabilize manufacturing quality. SOLUTION: This device is provided with a semiconductor chip 1, having a pad electrode 2, wire 3 bonded on the pad electrode 2, and sealing material formed by hardening liquid encapsulating resin 4 for encapsulating the semiconductor chip 1 by covering the pad electrode face, and a part of the wire 3 is exposed on the surface of the encapsulating material. Thus, since a part of the wire 3 is exposed on the surface of the encapsulating material so as to be used as an electrode for connection with the outside, it is not necessary to provide a conventional lead frame. Thus, the semiconductor device can be made compact and thin, and high density mounting can be attained. Also the number of item parts or materials are reduces so that costs can be reduced to pidlly, and manufacturing assembly is easily attained. Moreover, since the lead does not project so that handling is mode easy, connection failure based on lead deformation can be prevented, and yield can be improved. |
