| 摘要 |
A lead frame is provided. Although there is a die pad ( 2 ) located to deviate from a main plane center line of a resin molding area ( 10 ), a die pad connecting portion ( 6 ) is located to deviate from the main plane center line of the resin molding area in a direction opposite to the deviation direction of the deviated die pad ( 2 ), so that it is possible to reduce a Z-directional vertical variation of the die pad in processes. Accordingly, it is possible to prevent resin molding defects such as package bending, voids, failure of resin filling, wire disconnection, exposure of semiconductor chips, and exposure of die pads.
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