| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing multi-layer circuit board wherein working precision at forming a through hole is high, reliability in electrical connection is improved, and manufacturing process is simplified. SOLUTION: At least one layer constituting a conductor circuit substrate of multi-layers comprising a through hole, a resin pattern is provided in a region surrounded by a conductor, and the resin pattern is removed under high energy ray irradiation with a conductor pattern allocated outside the resin pattern as a mask. |
