| 摘要 |
PROBLEM TO BE SOLVED: To furthermore improve the stamping workability (the reduction of the wear of a stamping die and the burrs and sagging in a copper alloy subjected to punching) of a Cu-Ni-Si series alloy while satisfactorily maintaining its strength, electric conductivity, stress relaxation resistance and plating properties. SOLUTION: This invension is composed of a copper alloy having a compsn. contg., by weight, 0.1 to 4.0% Ni, 0.01 to 1.0% Si, 0.01 to 5.0% Zn and 0.0001 to 0.005% S, furthermore contg. one or >= two kinds of elements selected from the group of 0.00003 to 0.003% Se, 0.00003 to 0.003% Te, 0.00003 to 0.003% Sb and 0.00003 to 0.003% Bi by 0.00003 to 0.005% in total, and the balance Cu with inevitable impurities. |
