SURFACE PROCESSING OF THIN-FILM CVD DIAMOND FILM FOR IMPROVED RESISTANCE AND INTEGRATED CIRCUIT PACKAGE HAVING PROCESSED FILM

摘要

PROBLEM TO BE SOLVED: To provide a reliable method for increasing the resistance of a thin- film CVD diamond film coating a substrate. SOLUTION: A composite of thin-film diamond film 110 and a substrate 108 is treated in an apparatus for low-temperature plasma processing with an oxidizing gaseous element. During the treatment, the oxidizing plasma is reacted with a graphitic surface carbon to produce a volatile surface molecule, which is then sucked out of the diamond. The oxygen in the plasma is bound to the diamondlike carbon to stop the thin-film diamond film 110. An IC chip 102 and leads 106 are provided on the treated composite (thermally conductive and electrically resistant) as a base and the IC chip 102 and the leads 106 are connected with wires 116. Thereby, the leads 106 provide direct thermal dispersing conducting passages.