发明名称 RESIN COMPOSITION, RESIST INK COMPOSITION FOR FLEXIBLE PRINTED CIRCUIT BOARD AND CURED PRODUCT THEREOF
摘要 PROBLEM TO BE SOLVED: To obtain a composition excellent in flexibility, adherence, heat resistance and the like by admixing an epoxy group-containing thermoplastic elastomer, an aromatic glycidyl ether compound and a photo cation polymerization initiator. SOLUTION: There is provided a composition comprising 3-70 pts.wt. of an epoxy group-containing thermoplastic elastomer (A), 30-97 pts.wt. of an aromatic glycidyl ether compound (B), 0.01-30 pts.wt., based on 100 pts.wt. of (A+B), of a photo cation polymerization initiator (C) such as a diaryl iodonium salt and the like, further 0-50 wt.%, based on the component C, of a photosensitizer such as 9,10-phenylanthracene and the like, not more than 30 wt.%, based on (A+B+C), of an amine-based crosslinking agent, inorganic filler, a colorant and the like. This composition is coated to a thickness of 10-160μm on a circuit board by the screen printing method or the like and dried to obtain a coated film, which is irradiated with ultraviolet rays with a negative film contacted directly therewith, and subsequently the unexposed part is immersed in a developer to effect development followed by heat treatment at 100-200 deg.C to obtain a printed circuit board.
申请公布号 JPH11255865(A) 申请公布日期 1999.09.21
申请号 JP19980075108 申请日期 1998.03.10
申请人 NIPPON KAYAKU CO LTD 发明人 YOKOSHIMA MINORU;OKUBO TETSUO;SASAHARA KAZUNORI
分类号 H05K1/03;C08G59/20;G03F7/032;G03F7/038;(IPC1-7):C08G59/20 主分类号 H05K1/03
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