发明名称 PRODUCTION OF RESIN-SEALED MOLDED PRODUCT OF ELECTRIC/ ELECTRONIC PART
摘要 <p>PROBLEM TO BE SOLVED: To provide an industrially advantageous method for producing the resin-sealed molded products of electric/electronic parts in which various thermoplastic resins are used as raw materials and no complex process is required. SOLUTION: First, the surface of an electric/electronic part is coated with a low viscosity resin to form an integrated primary molding. Next, the primary molded product is inserted/fixed into/to an injection molding mold cavity, a thermoplastic resin for coating molding is injected/packed for coating molding, and simultaneously a resin-sealed molded product of a desired outer shell shape is formed.</p>
申请公布号 JPH11254477(A) 申请公布日期 1999.09.21
申请号 JP19980063075 申请日期 1998.03.13
申请人 MITSUBISHI ENG PLAST CORP 发明人 ITO TAKAYUKI
分类号 H01L21/56;B29C45/14;H01L23/29;H01L23/31;(IPC1-7):B29C45/14 主分类号 H01L21/56
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