| 摘要 |
The chip module has a chip element (1) with a number of termination points (7,7',7'') mounted on a carrier element (2) with a corresponding number of contact surfaces (5,5',5'') on the side opposite to that facing the chip element, electrically connected to the chip element termination points via conductive connections lying in the plane of the carrier element and openings extending through the carrier element. An Independent claim is also included for the production of a chip card.
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