发明名称 Leistungshalbleitermodul
摘要 In a four-layers circuit board on which a control circuit is arranged, wiring sub-patterns 133a in the first layer are divided into four areas A1-A3 and A8, for respective sets of circuit parts having same power potentials. Respective sub-patterns belonging to the areas A1-A3 are partially or fully surrounded by wiring sub-patterns PEa1-PEa3 connected to negative power potentials of circuit parts belonging to respective areas, respectively. Similarly, at least part of a wiring patten Pa2 for transmitting an input signal to a semiconductor active element is surrounded by a wiring pattern PEa4. Penetration of electric noises to the wiring patterns for the control circuit, in particular to the wiring pattern for transmitting the input signal to semiconductor element, is decreased to thereby prevent misoperation due to electric noises. <IMAGE>
申请公布号 DE69325953(D1) 申请公布日期 1999.09.16
申请号 DE1993625953 申请日期 1993.06.17
申请人 MITSUBISHI DENKI K.K., TOKIO/TOKYO 发明人 OSHIMA, SEIICHI;TAMETANI, FUMITAKA C/C MITSUBISHI DENKI K.K.;YAMAGATA, JUN C/O FUKURYO SEMICONDUCTOR ENG.CORP.;TAKANASHI, KEN C/O MITSUBISHI DENKI K.K.
分类号 H01L29/78;H01L23/538;H01L23/64;H01L25/07;H01L25/16;H01L25/18;H01L27/04;H01L29/739;H02M7/5387;H05K1/02;H05K1/14;H05K3/46;H05K9/00 主分类号 H01L29/78
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